🚀 Advanced Packaging Engineer

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Job Title: Advanced Packaging Engineer

Our innovative start-up, developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications, is seeking an Advanced Packaging Engineer . The role involves driving device packaging projects and roadmaps, developing 2.5/3D advanced packaging solutions, and liaising with OSATs throughout the project lifecycle, including concept exploration, design, DFM, engineering runs, development, and quality/reliability.

Managing the internal packaging team and driving overall package development within the company are key responsibilities. This position can be performed remotely.

Required Skills:

1. Strong semiconductor packaging experience and knowledge
2. Knowledge of 2.5/3D advanced packaging solutions
3. Excellent communication skills and team management abilities
4. Experience liaising with OSATs

Please contact Rachel Anderson for further details.