๐Ÿš€ Optical Packaging engineer

Hiring now โ€” limited positions available!

OCTOPYD

๐Ÿ’ฐ Earn $125.000 โ€“ $150.000 / year
  • ๐Ÿ“ Location: Sunnyvale
  • ๐Ÿ“… Posted: Oct 28, 2025

Overview

Our partner company is a privately held organization developing microLED-based ultra-low power, high-bandwidth interconnects for chip-to-chip communications. This technology is poised to revolutionize High-Performance Computing (HPC) and Cloud computing, as well as other industries where low-power interconnects are criticalโ€”such as camera sensors, autonomous vehicles, and aerospace. The company is headquartered in Sunnyvale, California, with a development center in Edinburgh, Scotland. It was founded in 2019 by leading technologists from the optical networking industry with a strong track record of delivering breakthrough products.

About the Role

  • Develop and test packaging solutions for multi-lane optical interconnects.
  • Design and test optical sub-assemblies with arrays of optical fibers.
  • Design multi-fiber optical connectors and work with external vendors to develop a connector ecosystem.
  • Design micro-array assembly processes, fixtures, and tooling.
  • Work with optical fibers, optimize optical launches, and conduct optical loss testing.
  • Develop mechanical/optomechanical test procedures.
  • Perform micron-level assembly techniques.
  • Measure material properties and interactions (e.g., epoxy selection, CTE, stress).
  • Conduct component reliability and qualification testing.

Required Qualifications

  • 5+ years of experience in Opto-Mechanical or Optical Packaging.
  • M.S. degree or higher in Opto-Mechanical Engineering, Physics, or a related field.
  • Preferred experience with Optical Transceiver assembly, Silicon Photonics, or Co-Packaged Optics.
  • Hands-on expertise with mechanical design software (e.g., SolidWorks) and mechanical modeling simulations.
  • Experience with optical modeling software (e.g., Zemax, LightTools) is an asset.
  • Knowledge of micro-replication techniques and polymer molding is an asset.
  • Ability to work independently in a fast-paced startup environment.
  • Strong teamwork and communication skills, with the ability to collaborate effectively across internal teams and external partners, customers, and consultants.

Position Details

  • Seniority level: Mid-Senior level
  • Employment type: Full-time
  • Job function: Industries: Semiconductor Manufacturing

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